Under the name DiaPlate, we have developed a family
of products for use in the electroforming process.
DiaPlate liquid resists are available for target
resist film thickness' from 5-500µm. The products are offered
addressing various rheologies and coating behaviors to match different
application techniques, among which spin-coating and roller-coating
are used most commonly.
formulations can be offered to provide optimum adhesion to substrates
like copper, steel, gold and chromium.
Common for all DiaPlate
liquid resists is their wide processing window and the capability
to allow an
easy and clean resist removal after plating.