Under the name DiaPlate, HTP has developed a family of products for use in the electroforming process.
DiaPlate liquid resists are available for target resist film thicknesses from 1-25μm. The products are offered addressing various rheologies and coating behaviours to match different application techniques, among which spin-coating and spray-coating are used most commonly.
Specific resist formulations can be offered to provide optimum adhesion to substrates such as copper, steel, gold and chromium.
Common to all DiaPlate liquid resists is their wide processing window and the capability to allow an easy and clean resist removal after plating.