Aqueous Processing Chemicals
HTP has acquired the business from KIV in an asset deal in June 2019. We seamlessly supply our customers in Switzerland and Europe with a proven aqueous process chemistry for circuit board production and chemical machining.
Our close business partner ahk service & solutions is the exclusive distributor for the KIV products in Germany.
Pre-cleaning and Surface Activation are necessary for an improved resist adhesion and different metals require different chemistry.
SC 220 M-verd is especially used as a pre-treatment chemical before a metal plating process. This chemistry is also suited for cleaning and activation of metal surfaces before applying resist.
CCA is an optimized cleaner/activator for copper surfaces and is preferred for the production of inner and outer layers in PWB production.
CME is a micro etching chemical to activate the surface prior to applying a resist.
DEL Developing Chemicals provide good dilution of soluble resist to obtain fine and detailed structures. DEL helps to keep the developing time at a low level.
ST Stripping Chemicals remove photoresists and solder masks without chlorinated solvents or phenol. There are different ST chemicals available for individual applications and applying methods like dipping or spraying.
MC Equipment Cleaning Chemicals are used to remove residues in developing or stripping equipment in PCM or PWB processing lines.
AF Antifoaming Agents reduces foam formation in aqueous processes like developing or stripping of photoresists.